In applications like laser deburring or conductive film processing, the HR-UC2 delivers micron-level precision. It can simultaneously remove resin毛刺 (resin burrs) from IC封装 while engraving identification marks, eliminating secondary processes and reducing cycle times4. Similarly, in新能源 (new energy) industries, it supports high-precision加工 (processing) of ITO films for circuit patterning, replacing traditional wet etching methods and minimizing chemical waste